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2 Layer Fill plane...

1 Oct 2011

legacyengineer

United States

Without having to go to a 4 layer board design and cost.  I want to stay with a 2 layer design, but still have a VSS plane on top  and GND plane on bottom....

 

I would normally do this with a fill plane, then connect my fill plane to my VSS source and connect the GND plane to a GND point and all other components I would that connect to each plane as needed.

I am not seeing the ability with Designspark PCB... I've added a closed filled object, but its not automatically add spacing around tracking and components, so I'm trying to see where I can implement this and stay with a 2 layer design.

I'm still very new at using the application, so perhaps I'm just missing it someplace and I'm hoping someone can point me in the right direction, thanks.

 

 

Curt

 

 

Replies

jgmartinez

Spain
32 weeks ago

You have to place a pour area instead an object. Pour area can be connected to a net, VCC, GND or any, and once is poured then it is connected to net and keep unconected to the other nets.
You can pour and unpour every time you need, if change of place a part you only have to unpour and pour again to get the new area correctly. You can enable thermal relief connection, remove unconnected areas, etc.