I have recently started using Designspark for designing PCB board layouts. I quite like the program and how things can be manipulated in the editor. So thanks for this nice free piece of software.
One issue I have is that I can't seem to be able to change (read: increase) the isolation distance between tracks and poured copper. I expected the Isolation Gap option in the Pour Copper dialog to take care of that, but that only increases the isolation distance between the pads that are on the same net as the poured copper and the poured copper itselft. Is there any way to increase the track -> poured copper isolation distance? Apart from modelling it by hand ;).
This is a picture of what I mean. It's just a nonsense circuit to test the issue after reinstalling Desisnsprak. You can see that the spoked pad, which is the GND, has a big circle of non copper around it. I used a 0.5 isolation gap as you can see in the dialog window.
DesignSpark PCB wired by RS - [PCB Design Test iso ]_2012-10-28_21-36-32.gif (26.76 KiB) Viewed 222 times
The distance between the poured copper (a shape) and the other elements in your pcb design is defined in the Design Technology > Spacings as can be seen in the screenshot. I hope this will help others in the future.
DesignSpark PCB wired by RS - [PCB Design Test iso ]_2012-10-28_22-12-57.gif (42.19 KiB) Viewed 219 times