Copper pour bug or am I misunderstanding something?
I am having trouble with the copper pour function around vias that aren't connected to the pour. As you can see from the attached screenshot, the top four vias have barely any clearance. Indeed I made one of the vias bigger just as a test, and the pour (yes I did re-pour after changing the via) makes no attempt to clear it.
As you can see the vias that are supposed to connect to the pour are cleared properly for the thermal spokes.
Is this a bug?
Let me know if you require any further information to analyse this issue.